3M™ XYZ-Axis Electrically Conductive Tape 9713 is an isotropically conductive pressure sensitive tape. 3M tape 9713 conducts electricity through the thickness (Z-axis) and in the plane of the adhesive (X, Y planes) and is ideal for EMI/RFI shield and EMI/RFI gasket attachment to metal surfaces. The tape consists of a high performance 3M adhesive loaded with conductive fibers. The result is a double-sided tape providing both good adhesion and good electrical performance. The
conductive fibers in 3M tape 9713 also provide improved handling characteristics.
3M™ XYZ-Axis Electrically Conductive Tape 9713 is ideal for attaching EMI shields to electronic and electrical devices. 3M tape 9713 may be used with many types of foil laminate shields, such as aluminum/PVC or copper/PVC laminates, to provide a customized shielding solution. This tape may also be used to attach conductive fabric/foam core EMI gaskets to electronic cabinetry. 3M tape 9713 may be applied in strips or die cut to specific shapes and sizes. Compared to screws or
other mechanical connectors, 3M tape 9713 provides reduced assembly time and a solid bond line with no gaps which might result in EMI emission.
• To obtain maximum adhesion, the bonding surfaces must be clean and dry. Isopropyl alcohol is recommended as a
• Bond strength is dependent upon the amount of adhesive-to-surface contact developed. This wetted area can be increased by applying 3M™ XYZ-Axis Electrically Conductive Tape 9713 firmly with a roller or finger pressure to exclude air entrapment. Adhesion is optimized when the substrates are flat or conformable substrates. Adhesion increases after application, up to 24 hours later, due to increased wetting by the tape.
• Electrical performance is dependent upon the nature of the metal and its surface. Most metal surfaces give enhanced electrical performance with 3M tape 9713 when the surface has been lightly abraded. Scotch-Brite™ pads are recommended for preparing the metal surface.
• 3M tape 9713 should be applied between 60°F - 100°F (15°C - 38°C). Tape application below 50°F (10°C) is not
recommended because the adhesive will be too firm to wet the substrates, resulting in low adhesion. Warming the substrates to 100°F (38°C) facilitates adhesion. Once properly applied, low temperature holding power is generally satisfactory.
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