{"product_id":"3m-5571-thermal-pad-custom-e-g-die-cut-a4-a5","title":"3M 5571 Thermal Pad, Custom (e.g., Die-Cut, A4, A5)","description":"\u003cp\u003e3M™ Thermally Conductive Silicone Interface Pad 5571 is a moderately conformable and medium-soft pad with a very high thermal conductivity of 5.0 W\/m-K (ASTM D5470).\u003cbr\u003e\nFeatures:-\u003c\/p\u003e\n\n \t\u003cp\u003eVery high thermal conductivity (4.9 W\/m-K)\u003cbr\u003e\n \tHardness :Shore 00 = 70\u003cbr\u003e\n \tGood softness and conformability even to non-flat surfaces\u003cbr\u003e\n \tSlight tack allows pre-assembly. Good wettability for better thermal conductivity\u003cbr\u003e\n \tGood dielectric properties\u003cbr\u003e\n \tUL 94 V-0\u003cbr\u003e\n \tHigh-temperature resistance\u003cbr\u003e\n \tTacky both sides\u003cbr\u003e\n \tThickness: 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness\u003cbr\u003e\n \tA larger sheet size is available\u003c\/p\u003e\n\n\u003cp\u003eApplications:-\u003c\/p\u003e\n\n \t\u003cp\u003eHeat transfer between PCB and heat sink\u003cbr\u003e\n \tIntegrated chip (IC) packaging heat conduction\u003cbr\u003e\n \tChip on film (COF) heat dissipation\u003cbr\u003e\n \tGap filling in electronic devices\u003cbr\u003e\n \tDecrease of compression stress to electronic parts by thermal pad softness\u003c\/p\u003e","brand":"Thermally Conductive Silicone Pad","offers":[{"title":"Default Title","offer_id":43327752077401,"sku":"ECDTHP0017","price":0.0,"currency_code":"INR","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0727\/5659\/2729\/files\/5516_cb8ea545-86dd-46f2-b64c-ef4d89621254.jpg?v=1779109097","url":"https:\/\/econtroldevices.com\/products\/3m-5571-thermal-pad-custom-e-g-die-cut-a4-a5","provider":"Econtroldevices","version":"1.0","type":"link"}