3M™ Thermally Conductive Acrylic Interface Pad 5571 has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.

Features :

• High thermal conductivity, 2.0 W/m-K on plane direction
• Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
• Passes UL 94 V-0 flame retardance test
• No siloxane outgassing or oil bleeding
• Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
• Good electrical insulation properties
• Slight tack allows easy pre-assembly
• Good wetting performance for better thermal conductivity

Applications:

• Heat transfer between PCB and heat sink
• Decrease of compression stress to electronic parts by thermal pad softness
• Gap filling in electronic devices
• Chip on film (COF) heat dissipation
• Power electronic component thermal management