3M™ Thermally Conductive Acrylic Interface Pad 5571 Size -300x20Mx1.5mm

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3M™ Thermally Conductive Acrylic Interface Pad 5571 Size -300x20Mx1.5mm

3M
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Specification Sheet:-  3M TCAIP 5571

3M™ Thermally Conductive Acrylic Interface Pad 5571 has a medium-soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting.

Features :

  • High thermal conductivity, 2.0 W/m-K on plane direction
  • Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
  • Passes UL 94 V-0 flame retardance test
  • No siloxane outgassing or oil bleeding
  • Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
  • Good electrical insulation properties
  • Slight tack allows easy pre-assembly
  • Good wetting performance for better thermal conductivity

Applications:

  • Heat transfer between PCB and heat sink
  • Decrease of compression stress to electronic parts by thermal pad softness
  • Gap filling in electronic devices
  • Chip on film (COF) heat dissipation
  • Power electronic component thermal management
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