3M™ Thermally Conductive Interface Tape 8708 Series

3M™ Thermally Conductive Interface Tape 8708 series have a pressure sensitive adhesive tape filled with thermally conductive ceramic particles. This product has different adhesion strength on top and bottom. 3M tape series 8708 demonstrates strong adhesion performance on the liner side through a uniquely constructed PSA layer. Softness of this product is good enough to wet-out well on uneven surfaces with normal bonding pressure (~1kgf/cm²) and maintains the holding power under some severe environmental conditions.

Features:- 

• Good thermal conductivity (0.6W/m-K)
• Electrically insulating
• Low thermal impedance
• Good and reliable adhesion performance for aluminum (Al) and steel use stainless (SUS)
• Vibration damping

Applications:-

• General heat sink bonding
• IC chip packaging heat conduction
• Printed circuit boards (PCB)
• LED module/board bonding
• Flat panel display assembly (e.g. LCD and PDP devices)
• COF chip heat conduction