3M™ Thermally Conductive Silicone Interface Pad 5516 Series is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M pad 5516 series consists of a highly conformable and slightly tacky silicone elastomeric sheets filled with thermally conductive ceramic particles that provide enhanced thermal conductivity and excellent electrical insulation performance.

Features:- 
Good softness and conformability even to non-flat surfaces
Very good thermal conductivity
Good electrical insulation properties
Compression relaxation properties reduces pressure to electric components
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance

Applications:- 
Integrated chip (IC) packaging heat conduction
Heat sink interface
COF chip heat conduction
LED board thermal interface material (TIM)

HD TV IC Chip
General gap filling in electronic devices