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Advanced Benefits of 3M Thermally Conductive silicone Pads
Thermally conductive silicone interface pad 5514 is an effective and suitable method to transfer heat. It is used for heat removal between active thermal components and between the heat sinks. It is a very soft and conformable thermally conductive silicone material. Its consistency offers physical strength and stability. It allows improved processing, and the 3M thermally conductive silicone interface pad 5514 can be customized. You can get it in alternative and prefabricated or die-cut form. It suits a broad array of applications for electronic designs. Thermally conductive pads have advantages that are connected with their ability of heat conduction:- Good thermal conductivity – 4.1 W/mK
- Fast and low-temperature cure
- Convenient 1:1 mix ratio by weight
- Retained softness after cure for enhanced stress relief during thermal cycling
- Excellent slump resistance (stays in place)
- Repairable
- Flame retardant:
- Certified UL94V-0
- Glass bead options available (180 & 250μm) for bond line thickness control
- Soft and conformable
- High-temperature tolerance
- High thermal conductivity
- Light tack allows for pre-assembly
- Outstanding compressive stress relaxation over the electronic device
- High-temperature resistance
- Good wettability for improved and lower thermal resistance
- Good dielectric properties
- Integrated Circuit (IC) chip packaging heat conduction
- Heat sink interface
- Chip on Film or COF heat conduction
- LED board Thermal Interface Material
- HD TV IC chip
- General gap filling in electronic devices



