3M™ Thermally Conductive Silicone Interface Pad 5514 Size :-250mmx20M

3M™ Thermally Conductive Silicone Interface Pad 5514 has a soft pad that conforms to uneven substrates, providing excellent wettability to fill gaps for improved thermal performance. The thin, firm, low-tack layer provides easy handling for pre-assembly and die-cutting. This pad provides robust thermal management for applications in a variety of market segments, such as consumer electronics, automotive, LED lighting, medical devices, communication infrastructure, and aerospace & defense.

Features :-

• Good thermal conductivity (1.6 W/m-K)
• Hardness : Shore 00 = 58
• Good dielectric properties
• UL 94 V-0
• High temperature resistance
• Good converting for complicated shape
• Good flexibility with over bending
• Thin thickness, 0.2 mm 0.25 mm
• Roll is available

Applications:
Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness