3M 5571 Thermal Pad, Custom (e.g., Die-Cut, A4, A5)

3M™ Thermally Conductive Silicone Interface Pad 5571 is a moderately conformable and medium-soft pad with a very high thermal conductivity of 5.0 W/m-K (ASTM D5470).
Features:-

Very high thermal conductivity (4.9 W/m-K)
Hardness :Shore 00 = 70
Good softness and conformability even to non-flat surfaces
Slight tack allows pre-assembly. Good wettability for better thermal conductivity
Good dielectric properties
UL 94 V-0
High-temperature resistance
Tacky both sides
Thickness: 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
A larger sheet size is available

Applications:-

Heat transfer between PCB and heat sink
Integrated chip (IC) packaging heat conduction
Chip on film (COF) heat dissipation
Gap filling in electronic devices
Decrease of compression stress to electronic parts by thermal pad softness