3M Thermally Conductive Silicone Interface Pad 5514 Size :-250mmx20M
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3M™ Thermally Conductive Silicone Interface Pad 5514 Size :-250mmx20M
Features :-- Good thermal conductivity (1.6 W/m-K)
- Hardness : Shore 00 = 58
- Good dielectric properties
- UL 94 V-0
- High temperature resistance
- Good converting for complicated shape
- Good flexibility with over bending
- Thin thickness, 0.2 mm 0.25 mm
- Roll is available
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
| Part Status | Active |
| Product | Thermally Conductive Interface Pad |
| Manufacturer | 3M |
| Manufacturer Part Number | 5514 |
| RoHS Status | RoHS compliant |
| Roll Length | 250mmx20M |
| Thickness | 0.2 mm 0.25 mm |
| Thermal Conductivity | 1.6 W/m-K) |
