3M Thermally Conductive Silicone Pad 230x320x1.5T - 5516
Guaranteed Safe Checkout
- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure (Shore 00 = 50)
- Softness results in low stress on board components
- Good dielectric properties
- Slight tack allows pre-assembly. Good wettability for better thermal conductivity
- UL 94 V-0
- High temperature resistance
- Tacky both sides
- Thickness: 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
- Larger sheet sizes are available
- Integrated chip (IC) packaging heat conduction
- Heat sink interface
- COF chip heat conduction
- LED board thermal interface material (TIM)
- HD TV IC Chip
- General gap filling in electronic devices
| Part Status | Active |
| Product | Thermally Conductive Interface Pad |
| Manufacturer Part Number | 5516 |
| Manufacturer | 3M |
| RoHS Status | RoHS compliant |
| Roll Length | 230×320 |
