Description
3M™ Thermally Conductive Silicone Interface Pad 5514 is a very conformable and soft pad with thermal conductivity of 1.6 W/m-K (QTM-500). This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat-generating components to heat sinks and cooling devices, improving device reliability and extending the component’s life.
Features:-
- Good thermal conductivity (1.6 W/m-K)
- Hardness: Shore 00 = 58
- Good dielectric properties
- UL 94 V-0
- High temperature resistance
- Good converting for complicated shape
- Good flexibility with overbending
- Thin thickness, 0.2 mm, 0.25 mm
- Roll is available
Applications:
- Heat transfer between PCB and heat sink
- Integrated chip (IC) packaging heat conduction
- Chip on film (COF) heat dissipation
- Gap filling in electronic devices
- Decrease of compression stress to electronic parts by thermal pad softness
Reviews
There are no reviews yet.