3M 5519 Conductive Silicon Pad( 210X155X0.5T)

3M™ Thermally Conductive Silicone Interface Pad 5519 is a moderately conformable and medium-soft pad with very high thermal conductivity of 5.0 W/m-K (ASTM D5470). This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component’s life.

Features :-

  • Very high thermal conductivity (4.9 W/m-K)
  • Hardness :Shore 00 = 70
  • Good softness and conformability even to non-flat surfaces
  • Slight tack allows pre-assembly. Good wettability for better thermal conductivity
  • Good dielectric properties
  • UL 94 V-0
  • High temperature resistance
  • Tacky both sides
  • Thickness : 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
  • Larger sheet size is available

Applications:-

  • Heat transfer between PCB and heat sink
  • Integrated chip (IC) packaging heat conduction
  • Chip on film (COF) heat dissipation
  • Gap filling in electronic devices
  • Decrease of compression stress to electronic parts by thermal pad softness
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