Introduction to PCB Plating Process
PCB is the short term for printed circuit boards. Printed circuit boards are the core of any modern electronic system, whether it’s a medical device or a smart gadget like a smart watch or a smartphone. Manufacturing these PCBs requires extreme knowledge and precision. Because the slightest errors can lead to significant performance drawbacks in the electrical system or appliances.Â
Also, PCB planting is one of the most delicate and important parts of PCB manufacturing. The PCB planting process refers to the stage of component placement on the PCB. In this stage, all the essential components, including resistors, integrated circuits and capacitors, are installed on a bare printed circuit board systematically and precisely. The placement of each component plays a crucial role in determining the performance of the product. Therefore, proper PCB planting is essential for error-free PCB manufacturing.Â
In PCB or printed circuit board plating, one thing that plays a prominent role is played by the circuit plating tape. The proper use of circuit plating tape can ensure the accuracy and effectiveness of the PCB planting process. Therefore, if you are involved in PCB manufacturing, you should learn about the proper use of circuit plating tape in PCB planting. Here is a step-by-step guide to help you with the accurate use of circuit plating tape for the PCB planting process.Â
What Is Circuit Plating Tape?
A circuit plating tape is a specialised adhesive tape primarily used for PCB or printed circuit board plating works. It is usually made of polyester film and a unique adhesive that can easily withstand heat, solvents and chemicals used in the plating process. The primary function of the circuit plating tape is to protect certain parts of the PCB board from the electroplating solutions.Â
It is a specialised adhesive tape only used for PCB or printed circuit board plating that differs from regular masking tapes. This tape includes durable polyester film and a unique adhesive that can withstand heat and other electroplating solutions, which a regular masking tape cannot.Â
Why Circuit Plating Tape Is Used in PCB Manufacturing?
Circuit plating tape is a specialised adhesive tape primarily designed for PCB manufacturing works.Â
Protecting Non-Plating Areas
Circuit tapes help to protect the non-plating areas of the PCB or printed circuit board from solvent and other electroplating solutions.Â
Maintaining Clean Edges and Precision
Using circuit tapes also helps to maintain clean edges and ensure higher precision in the plating process. It also increases the quality of the PCB planting outcome.Â
Preventing Electrical Short Circuits
Lastly, the use of circuit plating tape also helps in preventing electrical short circuits as it prevents leakage of electroplating solutions to the non-plating areas of the board and keeps every component in its place.Â
Step-by-Step Guide: How Circuit Plating Tape Is Applied
Proper and error-free use of circuit plating tape is essential for quality PCB manufacturing. Here are the steps for proper circuit plating tape application in the PCB planting process-
Step 1 – Cleaning and Preparing the PCB Surface
The first and most essential step of circuit plating tape application is cleaning and preparing the PCB surface. Use proper cleaning tools to clean and prepare masking areas.
Importance of a Dust-Free Surface
Note that a dust-free surface is essential for higher accuracy in circuit plating tape application, as dust and other contaminants can affect the adhesion quality.Â
Step 2 – Identifying Areas to Be Masked
Once you are done with the cleaning and preparing of the PCB surface, you can move to identify areas where you need circuit plating tape masking. Mark areas where you will not do any electroplating.Â
Common Areas That Need Protection
In most cases, the edges and spaces between two components require masking to prevent short circuits and keep the PCB surface clean.Â
Step 3 – Applying the Circuit Plating Tape
After the identification of PCB surface masking areas, you can further move to apply the tape. Try seamless one-stroke applications from top to bottom or side-to-side applications techniques for error-free application.Â
Manual vs. Automated Application Methods
However, automated application methods are more reliable and accurate than manual application as they can ensure error-free application.Â
Step 4 – Ensuring Proper Adhesion
Applying the tape properly is not enough; you have to ensure proper adhesion before moving on to the electroplating process.Â
Recommended Temperature and Pressure Settings
Usually, the tape application for PCB planting manufacturing requires moderate pressure with a temperature between 21° and 38°. However, this can vary depending on the tape type, manufacturer and plating process.Â
Step 5 – Proceeding with the Plating Process
Once proper adhesion is ensured, you can proceed with the plating process. This may include both electroplating and electroless plating stages.
Electroplating or Electroless Plating Stages
Electroplating usually tends to be more precise and accurate than the electroless plating process, as it involves advanced and automated plating that prevents error in component placement.Â
Step 6 – Removing the Tape After Plating
After you are done with the plating process, you need to remove the circuit plating tape smoothly and systematically.Â
Safe Tape Removal Without Residue
Use side-to-side or corner-to-corner removal to prevent residue left on the surface. You can also use a surface cleaner once you have removed the tape to ensure no residue is left.
Types of Circuit Plating Tapes Used in the Process
There are various types of CPTs that are used in the PCB manufacturing process. Here are some key types of circuit plating tapes:
Polyimide (Kapton) Plating Tape
Polyimide (Kapton) plating tapes use Polyimide films to offer high levels of resistance against heat and chemical solvents.
 Polyester (PET) Plating Tape
Polyester plating tapes offer high levels of flexibility. They are low-stretch and ensure tight masking of specific areas in the printed circuit board.
 High-Temperature Masking Tapes
High-temperature masking tapes use materials and adhesives that are resistant to excessive heat for safe usage during processes such as soldering and plating.
Benefits of Using Circuit Plating Tape During PCB Plating
Circuit plating tapes offer a number of benefits in the PCB manufacturing process. Here are some of them:
Precision and Accuracy
CPT ensures tight and crisp masking of certain areas that need to be protected to ensure precise and accurate coating of the finished products.
Time and Cost Efficiency
Precise and accurate masking ensures the safety of sensitive components, reducing the time of the plating process. Proper masking also reduces the costs of reworking.
Improved Surface Finish and Circuit Reliability
Other important benefits of using CPT in PCB manufacturing are circuit reliability because of electrical insulation. It also enhances the surface finish of finished products.
Common Issues and Troubleshooting Tips
Though a number of benefits are provided by the use of CPT, it also has some common issues that should be addressed for proper use:
Tape Peeling or Lifting During Plating
One of the most common issues with circuit plating tapes is tape lifting or peeling during the plating process. It is largely caused by poor-quality adhesives. Choose tapes with advanced and quality adhesives.
Residue After Tape Removal
Some tapes also leave residue after removal. Choose a high-quality tape and use proper removal techniques to ensure zero residue after take-off.
Uneven Plating or Leakage Problems
Leakage or uneven plating are other common issues of circuit plating tapes. To ensure even plating, one must properly prepare the surface and choose tapes with quality adhesion that fill any gaps on the surface.
Best Practices for Applying Circuit Plating Tape
Circuit plating tapes should be properly used. Here are some best practices for using CPT:
Storage and Handling Tips
First and most importantly, store the tapes in cool and dry places. Keep it away from sunlight and heat.
Choosing the Right Tape Width and Thickness
Also, choose the right tape type. Consider the width and thickness of a tape. Choose a tape that suits the surface of the PCB.
Testing Adhesion Before Full Application
Test the adhesion before the full application of the tape. Check that the surface is dry and clean before applying the tape to it.
Quality Control After Tape Removal
Safe tape removal is important. However, quality control of the finished products after the tape removal is also crucial. Here are some tips for quality control:
Checking for Surface Contamination
Safely remove the tape without leaving any residue. Also, check for surface contamination after tape removal and clean the surrounding areas to reduce the chances of contamination.
Visual Inspection and Electrical Testing
Visually inspect the surface after removing the tape. Electrical testing can also ensure proper and precise coverage.
Safety and Environmental Considerations
Safe and environmentally friendly use of circuit plating tape is essential. Here are some key tips:
Handling Chemicals During Plating
Use proper safety precautions while handling chemicals during the PCB plating process.Â
Safe Disposal of Used Tape
Once the process is finished, safely remove and dispose of the used circuit plating tapes.
Conclusion
Key Takeaways on Using Circuit Plating Tape Effectively
Using circuit plating tape for PCB planting manufacturing requires proper cleaning and preparation of the surface, identifying masking areas, proper and systematic application, securing adhesion, plating other areas, and lastly, carefully removing tape. Â
Why Proper Tape Application Improves PCB Quality?
Remember, proper application of the circuit plating tape can effectively improve the PCB or printed circuit board quality and accuracy. Therefore, always ensure proper and expertly provided circuit plating tape application for PCB manufacturing. At Econtroledevices, you can get quality PCB and circuit board plating tape for your electronic devices.
