3M 5571 Thermal Pad for Computer

Description

3M 5571 Thermally Conductive Acrylic Interface Pad for Computer

3M 5571 Thermal Pad for Computer – The 3M™ 5571 Thermally Conductive Acrylic Interface Pad is used in computer systems to provide a thermal interface between heat-generating electronic components and a cooling surface such as a heat sink or metal plate. It supports improved thermal contact where direct surface contact is limited due to gaps or uneven surfaces.

3M™ 5571 is a single-layer thermally conductive acrylic interface pad. It consists of a slightly tacky acrylic elastomer sheet with a conductive ceramic filler. The pad is moderately conformable, allowing it to adapt to surface irregularities commonly found in computer assemblies.

Key Highlights

• UL94 V-0 listed
• Does not contain intentionally added silicone
• No siloxane VOC or oil bleeding associated with silicone products
• Conformable material suitable for non-flat surfaces
• Soft, compliant structure helps reduce localized pressure on components
• Good electrical insulation properties
• Good wetting performance for improved thermal contact
• Includes a thin acrylic handling layer for easier pre-assembly and die-cutting

Thermal Performance

• Thermal Conductivity: 2.1 W/m·K

This thermal performance supports consistent heat transfer across the interface when properly installed.

Material Characteristics

• Acrylic elastomer-based thermal interface pad
• Medium-soft consistency
• Single-layer construction
• Slight tack for placement stability during assembly

Purpose of Using a Thermal Pad in Computer Systems

In computer hardware, thermal pads like 3M™ 5571 are used to improve thermal coupling between components and cooling elements. They help fill air gaps created by tolerance differences, board flex, or surface unevenness, supporting more stable thermal management without the use of liquid materials.

Thickness Selection for Computer Use

Thickness should be selected based on the measured gap between the component and the cooling surface. The pad should compress enough to ensure contact while avoiding excessive force. Final selection should be validated during design or servicing.

Typical Computer-Related Applications

The 3M™ 5571 thermal pad may be used in computer systems for thermal interfacing of:

• Electronic components requiring contact with a heat sink
• Control ICs and supporting chips
• Power-related components within computer enclosures
• Other assemblies where a solid thermal interface pad is specified

Handling and Assembly Benefits

• Easy positioning due to slightly tacky surface
• No curing or mixing required
• Suitable for pre-assembly and die-cut formats
• Cleaner alternative to grease-based materials

Important Notes

• Follow official 3M technical documentation
• Do not stack pads unless specified
• Avoid over-compression during installation
• Actual performance depends on surface contact and assembly conditions