3M Thermally Conductive Silicone Interface Pad 5514

Description

3M™ Thermally Conductive Silicone Interface Pad 5514 is a very conformable and soft pad with thermal conductivity of 1.6 W/m-K (QTM-500). This pad consists of a slightly tacky silicone elastomeric sheet filled with thermally conductive ceramic particles. It is designed to transfer heat from heat generating components to heat sinks and cooling devices, improving device reliability and extending the component’s life.

Features :

• Good thermal conductivity (1.6 W/m-K)
• Hardness : Shore 00 = 58
• Good dielectric properties
• UL 94 V-0
• High temperature resistance
• Good converting for complicated shape
• Good flexibility with over bending
• Thin thickness, 0.2 mm 0.25 mm
• Roll is available

Applications:

• Heat transfer between PCB and heat sink
• Integrated chip (IC) packaging heat conduction
• Chip on film (COF) heat dissipation
• Gap filling in electronic devices
• Decrease of compression stress to electronic parts by thermal pad softness