3M Thermally Conductive Silicone Interface Pad 5514 Size :-250mmx20M

Description

3M™ Thermally Conductive Silicone Interface Pad 5514 Size :-250mmx20M

Features :-

• Good thermal conductivity (1.6 W/m-K)
• Hardness : Shore 00 = 58
• Good dielectric properties
• UL 94 V-0
• High temperature resistance
• Good converting for complicated shape
• Good flexibility with over bending
• Thin thickness, 0.2 mm 0.25 mm
• Roll is available

Applications:

• Heat transfer between PCB and heat sink
• Integrated chip (IC) packaging heat conduction
• Chip on film (COF) heat dissipation
• Gap filling in electronic devices
• Decrease of compression stress to electronic parts by thermal pad softness