3M Thermally Conductive Silicone Pad 5516S (230X320X0.5T) Sheet

Description

3M™ Thermally Conductive Silicone Interface Pad 5516 Series is designed to provide a preferential heat transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices.

Features: 

• Good softness and conformability even to non-flat surfaces
• Very good thermal conductivity
• Good electrical insulation properties
• Compression relaxation properties reduces pressure to electric components
• Slight tack allows pre-assembly
• Good wettability for improved and lower thermal resistance

Applications:

• Integrated chip (IC) packaging heat conduction
• Heat sink interface
• COF chip heat conduction
• LED board thermal interface material (TIM)
• HD TV IC Chip
• General gap filling in electronic devices