3M 5519 Conductive Silicon Pad( 210X155X0.5T)

Description

3M™ Thermally Conductive Silicone Interface Pad 5519 is a moderately conformable and medium-soft pad with a very high thermal conductivity of 5.0 W/m-K (ASTM D5470).

Features:-

• Very high thermal conductivity (4.9 W/m-K)
• Hardness :Shore 00 = 70
• Good softness and conformability even to non-flat surfaces
• Slight tack allows pre-assembly. Good wettability for better thermal conductivity
• Good dielectric properties
• UL 94 V-0
• High-temperature resistance
• Tacky both sides
• Thickness: 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
• A larger sheet size is available

Applications:-

• Heat transfer between PCB and heat sink
• Integrated chip (IC) packaging heat conduction
• Chip on film (COF) heat dissipation
• Gap filling in electronic devices
• Decrease of compression stress to electronic parts by thermal pad softness