Description
3Mâ„¢ Thermally Conductive Silicone Interface Pad 5516 Series is designed to provide a preferential heat transfer path between heat-generating components and heat sinks, heat spreaders or other cooling devices. 3M pad 5516 series consists of highly conformable and slightly tacky silicone elastomeric sheets filled with thermally conductive ceramic particles that provide enhanced thermal conductivity and excellent electrical insulation performance.
Features:
- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure (Shore 00 = 50)
- Softness results in low stress on board components
- Good dielectric properties
- Slight tack allows pre-assembly. Good wettability for better thermal conductivity
- UL 94 V-0
- High temperature resistance
- Tacky both sides
- Thickness: 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
- Larger sheet sizes are available
Application:-Â
- Integrated chip (IC) packaging heat conduction
- Heat sink interface
- COF chip heat conduction
- LED board thermal interface material (TIM)
- HD TV IC Chip
- General gap filling in electronic devices









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