Description
3M™ Thermally Conductive Silicone Interface Pad 5516 Series is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M pad 5516 series consists of a highly conformable and slightly tacky silicone elastomeric sheets filled with thermally conductive ceramic particles that provide enhanced thermal conductivity and excellent electrical insulation performance.
Features:
- Good thermal conductivity (3.1 w/m-k)
- Good softness and is conformable at low pressure ( Shore 00 = 50)
- Softness results in low stress on board components
- Good dielectric properties
- Slight tack allows pre-assembly. Good wettability for better thermal conductivity
- UL 94 V-0
- High temperature résistance
- Tacky both sides
- Thickness : 0.5 mm,1.0 mm, 1.5 mm, 2.0 mm, custom thickness
- Larger sheet size is available
Application :-
- Integrated chip (IC) packaging heat conduction
- Heat sink interface
- COF chip heat conduction
- LED board thermal interface material (TIM)
- HD TV IC Chip
- General gap filling in electronic devices
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